| 摘要 |
A first insulating layer is formed on a front surface of a rectangular circuit board. Conductive patterns having a predetermined shape are formed on a front surface of the first insulating layer. A semiconductor element and a chip element are electrically connected to the conductive patterns by use of solder or conductive paste. The conductive patterns, the semiconductor element and the chip element which are formed on the front surface of the circuit board, are covered with a sealing resin. Pads on the circuit board and leads are connected to each other by use of thin metal wires.
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