LASERBEARBEITUNGSVORRICHTUNG, VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG EINER MEHRSCHICHTIGEN, GEDRUCKTEN LEITERPLATTE

摘要

A multilayer printed wiring board manufacturing apparatus comprising a CO2 laser source (60), a scanning head (70) for deflecting the direction of laser beam in the X-Y table (80) for displacing the position of the multilayer printed wiring board, wherein the laser beam oscillated from said CO2 laser source is converted to the beam of shortened wavelength by harmonic wave generating means (94).