| 摘要 |
<p>A method for manufacturing a piezoelectric device, comprises: (a) forming a bonding electrode (25) so that the bonding electrode extends along an outer shape of a piezoelectric substrate (21) and is electrically coupled to a taking out electrode (23) on the piezoelectric substrate, (b) forming a through hole (23) to the cover so that an edge of the through hole is positioned inside an outer shape of the taking out electrode in a plan view when the relative position between cover and the piezoelectric substrate is aligned; (c) forming a first glass film (34) on a surface of the cover so that the first glass film surrounds an entire circumference of the through hole and the first glass film makes contact with the taking out electrode when the relative position is aligned; (d) forming a second glass film (33) on the first surface of the cover so that the second glass film makes contact with the bonding electrode and seals a gap between the cover and the bonding electrode when the relative position is aligned; (e) bonding the first glass film to the taking out electrode as well as the second glass film to the bonding electrode by generating an electric field; and (f) cutting an electrical coupling between the taking out electrode and the bonding electrode after step (e).</p> |
