| 摘要 |
A method for simultaneously slicing at least two cylindrical workpieces with a multiplicity of wafers is provided to prevent damage of the wafer when a separation element is inserted by using a multi wire saw. A selection process is performed to select n-number of workpieces among workpieces having different lengths. The n-number of workpieces are sequentially fixed on a mounting plate(11) in a vertical direction and, simultaneously, intervals among the workpieces are constantly maintained. A mounting plate provided with the fixed workpieces is clamped on a multi wire saw. The multi wire saw slices the workpieces in a direction perpendicular to the vertical direction to form n-number of stacks(121,122,123) of a wafer(12) fixed on the mounting plate. The wafer fixed on the mounting plate is inputted into a wafer carrier(13) at two points on a circumference of the wafer spaced away from the mounting plate. A separation element is inserted into between the adjacent two stacks of the wafer and fixed on the wafer carrier. A coupling between the wafer and the mounting plate is released. The wafer is removed from the wafer carrier.
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