Electronic device and method of manufacturing the same

摘要

An electronic device that enables securing excellent hollow structure and close air-tightness of the space between the substrate and the electronic component, without incurring degradation in production efficiency, is to be provided. The electronic device includes a mounting substrate, an electronic component mounted on the mounting substrate, and a resin film provided all over the mounting substrate, so as to cover the electronic component. The resin film has a shear viscosity equal to or more than 100 kPa·s and equal to or less than 1000 kPa·s and a flow length equal to or more than 100 µm and equal to or less than 1500 µm.