半导体制造用下部保温筒,申请号CN200730004641.5-传众专利搜索

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发明名称	半导体制造用下部保温筒
摘要
申请公布号	CN300773401D	申请公布日期	2008.04.30
申请号	CN200730004641.5	申请日期	2007.02.12
申请人	东京毅力科创株式会社	发明人	佐藤泉
分类号	23-03	主分类号	23-03
代理机构	北京纪凯知识产权代理有限公司	代理人	龙淳
主权项
地址	日本东京

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