THE HEAT-CONDUCTIVE ADHESIVE

摘要

A thermal conductive pressure sensitive adhesive is provided to improve thermal stability and to prevent the deterioration of the coherence of an adhesive and the separation of a heat radiator and a heat generator. A thermal conductive pressure sensitive adhesive is a gel type pressure sensitive adhesive which comprises 45-75 wt% of a silicone adhesive; and 25-55 wt% of a thermal conductive filler. Preferably the silicone adhesive is prepared by reacting 38-70 wt% of hydroxyl-terminated polydimethylsiloxane and 30-46 wt% of a silicone resin in the presence of an alkali catalyst; and the thermal conductive filler is selected from aluminum oxide, aluminum hydroxide, aluminum nitride and boron nitride having a particle size of 1-120 micrometers and comprises a particle having a large particle size and a particle having a small particle size.