发明名称 PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS
摘要 <p>THE PRESENT INVENTION PROVIDES A SHEET (10) TO FORM A PROTECTIVE FILM FOR CHIPS, WHICH CAN BE READILY FORMED INTO A HIGHLY UNIFORM PROTECTIVE FILM ON A BACK SURFACE OF CHIP, AND WHICH, EVEN IF MINUTE SCRATCHES ARE FORMED ON THE BACK SURFACE OF CHIP AS A RESULT OF MECHANICAL GRINDING, CAN ELIMINATE ADVERSE EFFECTS RESULTING FROM THE SCRATCHES. THE SHEET (10) TO FORM A PROTECTIVE FILM FOR CHIPS OF THE PRESENT INVENTION COMPRISES A RELEASE SHEET (1) AND A PROTECTIVE FILM FORMING LAYER (2) FORMED ON A DETACHABLE SURFACE OF THE RELEASE SHEET (1), WHEREIN SAID PROTECTIVE FILM FORMING LAYER (2) COMPRISES A THERMOSETTING OR ENERGY RAY-CURABLE COMPONENT AND A BINDER POLYMER COMPONENT.(FIG 2)</p>
申请公布号 MY135433(A) 申请公布日期 2008.04.30
申请号 MY2002PI00956 申请日期 2002.03.18
申请人 LINTEC CORPORATION. 发明人 HIDEO SENOO;TAKASHI SUGINO;OSAMU YAMAZAKI
分类号 C09J7/00;C09J133/00;C09J163/00;H01L21/301;H01L21/58;H01L21/68;H01L21/78;H01L23/00;H01L23/31;H01L23/48 主分类号 C09J7/00
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