SLURRIES AND METHODS FOR CHEMICAL-MECHANICAL PLANARIZATION OF COPPER

摘要

The claimed invention involves a novel aqueous slurry for chemical-mechanical planarization that is effective for polishing copper at high polish rates. The aqueous slurry according to the present invention comprises particles of MoO2 or MoO3 and an oxidizing agent. A method for polishing copper by chemical-mechanical planarization includes contacting copper with a polishing pad and an aqueous slurry comprising particles Of MoO2 or MoO3 and an oxidizing agent.