Method for manufacturing a material compound wafer,申请号EP20040291472-传众专利搜索

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发明名称	Method for manufacturing a material compound wafer
摘要
申请公布号	EP1605505(B1)	申请公布日期	2008.04.23
申请号	EP20040291472	申请日期	2004.06.11
申请人	S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.	发明人	MAURICE, THIBAUT;GUIOT, ERIC
分类号	H01L21/762;H01L21/20;H01L21/66	主分类号	H01L21/762
代理机构		代理人
主权项
地址

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