Cover for optoelectronic components

摘要

A method for manufacturing a LED module comprises the following steps:
- mounting a LED chip on a board,
- making on the board an outer ring made from a liquid resin, the outer ring surrounding the LED chip,
- making a central filling of the volume defined by the outer ring, the central filling being made from a liquid resin and covering the top surface of the LED chip,
- curing in one single step the resin of the outer ring and the central filling and making a chemically linked interface between the outer ring and the central filling.