Optoelectronic device and production method

摘要

Opto-electronic device has circuit board (2) with opto-electronic element (1), which is electrically contacted with bond pad (2.2) by wire bonding (3) and is fastened to ground pad (2.1) by means of solder connection. Ground pad is so designed that a part of the intermediate region between circuit board and opto-electronic element is not filled in with a plumb (5). An independent claim is also included for the method for the production of the opto-electronic device.