发明名称 |
Circuit element |
摘要 |
A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device. |
申请公布号 |
GB2406969(B) |
申请公布日期 |
2008.04.23 |
申请号 |
GB20040019641 |
申请日期 |
2004.09.03 |
申请人 |
AGILENT TECHNOLOGIES, INC.;AVAGO TECHNOLOGIES GENERAL IP;AVAGO TECHNOLOGIES ECBU IP |
发明人 |
KEE YEAN NG;CHENG WHY TAN;JI KIN THAM |
分类号 |
H01L23/34;H01L23/36;H01L23/48;H01L33/62;H01L33/64 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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