| 摘要 |
A first laminate block including inner conductors is manufactured, and thin holes are formed in the first laminate block so as to extend between top and bottom surfaces of the first laminate block. The thin holes are filled with conductive paste to form via holes. Then, a ceramic sheet layer is laminated on the bottom surface of the first laminate block, and a second laminate block including inner conductors is laminated on the bottom surface of the ceramic sheet layer to obtain a laminate body. Then, thin holes are formed in the laminate body so as to extend between top and bottom surfaces of the laminate body, and are filled with conductive paste to obtain through via hole. |
