发明名称 MULTI LAYER CHIP CAPACITOR, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
摘要 The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.
申请公布号 EP1913608(A1) 申请公布日期 2008.04.23
申请号 EP20060768973 申请日期 2006.06.21
申请人 SEHYANG INDUSTRIAL CO.,LTD. 发明人 HA, JAE-HO
分类号 H01G4/228;H01G4/008;H01G4/012;H01G4/08;H01G4/232;H01G4/30;H01G13/00 主分类号 H01G4/228
代理机构 代理人
主权项
地址