| 发明名称 |
Printed wiring board and printed wiring board manufacturing method |
| 摘要 |
The present invention relates to a printed wiring board (110) having solder bumps (76U) forming a BGA. The solder bumps are disposed on conductor circuits (158) exposed by openings in a solder resists layer (70) made of organic insulating resin. A single metal layer of noble metal (174) is provided on said exposed conductor circuits, under said solder bumps. |
| 申请公布号 |
EP1915040(A2) |
申请公布日期 |
2008.04.23 |
| 申请号 |
EP20070117547 |
申请日期 |
2002.09.30 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
NAKAI, TORU |
| 分类号 |
H05K3/34;C23C18/31;C23C18/44;C23C18/54;H01L21/48;H01L21/60;H01L23/12;H01L23/498;H01L23/538;H05K1/11;H05K3/24;H05K3/28;H05K3/38;H05K3/46 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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