| 摘要 |
An electronic device handler for a bonding apparatus is provided to configure a system capable of automatically bonding an electronic device having a large bonding area without increasing a y-axis table range of a positioning table to place the electronic device under a bonding tool during a bonding process. A bonding apparatus(10) for electronic devices comprises a bonding tool(20), a storage assembly(16,18), a conveying track(12), and a rotary platform(14). An electronic device(22) for bonding is able to be located at the bonding tool. The storage assembly is configured to store multiple electronic devices. The conveying track carries the electronic device to make an access to or move back from the bonding tool, wherein the rotary platform can be operated between a point where the rotary platform is aligned to convey the electronic device between the rotary platform and the conveying track, and another point where the rotary platform is aligned with the storage assembly to convey the electronic device between the rotary platform and the storage assembly. |
