| 摘要 |
Disclosed is a wiring board including: a first insulating layer made of a flexible material; a second insulating layer stacked on a partial region of the first insulating layer; a first wiring layer disposed between the first insulating layer and the second insulating layer; and a second wiring layer disposed on the second insulating layer, wherein the first insulating layer is composed of two or more insulating layers and further has a third wiring layer in each interlayer of the two or more insulating layers, wherein an electric interlayer connection between the first wiring layer and the third wiring layer has a plating layer of a hollow cylindrical shape or a hollow truncated cone shape, and inside of the hollow is filled by a material of the second insulating layer being transformed and entering therein.
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