| 摘要 |
A heater for use in fabrication of a semiconductor device is provided to effectively maintain the uniformity of temperature by dividing a heat coil into several sections along a predetermined distance from a center of the heat coil. A heater includes a base plate, a heat coil(20) spirally formed on an upper surface of the base plate, and an insulating layer formed on the heat coil. The upper surface of the base plate is etched in the same pattern as the shape of the heat coil, and the heat coil is bonded to the base plate by an adhesive. In case of the heat coil having a rectangular cross section, the upper portion of the heat coil is flush with the upper surface of the base plate to prevent the heat from being lost through a gap between the heat coil and the insulating layer. The heat coil is divided into five sections to form first to fifth sections having different line width.
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