发明名称 CAPACITOR, METHOD OF MANUFACTURING THEREOF AND PRINTED CIRCUIT BOARD HAVING THE CAPACITOR
摘要 A capacitor, a manufacturing method thereof, and a printed circuit board with the capacitor are provided to improve adhesion force between the capacitor and an insulation layer. A printed circuit board includes a first electrode layer, a second electrode layer, a dielectric layer(20), and an insulation layer. One surface of the second electrode layer is opposed to the first electrode layer. A protrusion(15) is formed on the other surface of the second electrode layer. The dielectric layer is interposed between the first electrode layer and the second electrode layer. The protrusion is made of the same material as the second electrode. The protrusion is formed in plural. The plurality of protrusions is arranged at a regular interval. The protrusion is formed through electrolyte plating. The insulation layer is stacked on the other surface of the second electrode layer.
申请公布号 KR20080034691(A) 申请公布日期 2008.04.22
申请号 KR20060100955 申请日期 2006.10.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, WOON CHUN;CHUNG, YUL KYO
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
代理机构 代理人
主权项
地址