SEMICONDUCTOR PACKAGES HAVING ANALYTICAL PROBING AREA ON PACKAGING PAD

摘要

A semiconductor package is provided to precisely analyze a defect cause generated after shipping by using an analytical probe region on a packaging pad. A semiconductor substrate(10) has a data storage region and a data-processing peripheral circuit region. At least one packaging pad(31) is disposed on the semiconductor substrate, positioned in the data-processing peripheral circuit region to be electrically connected to the at least one of the data storage region and the data-processing peripheral circuit region. The packaging pad includes a wire bonding region(36) and an analytical probe region(33) adjoining the wire bonding region. A passivation layer(40) is disposed to cover the analytical probe region, the data-processing peripheral circuit region and the data storage region. A printed circuit board can be formed under the semiconductor substrate, electrically connected to the printed circuit board via the wire bonding region.