发明名称 SINGLE FOOTPRINT FAMILY OF INTEGRATED POWER MODULES
摘要 <p>A single footprint family of integrated power modules is provided to specify a particular power level chosen for the power module later in the design process, wherein adjustments to the power requirements would not result in a change in the size of the overall power module. A process for defining a single footprint family of integrated power modules comprises the following several steps. A power module supplier identifies a range of power outputs to be supplied by a family of power modules(402). A single footprint size is selected to cover the power modules that span the range of power outputs(404). A plurality of discrete FET(Field Effect Transistor) sizes for that family of power modules are defined(406). Finally, discrete FET sizes are incorporated within power modules having the same footprint(408).</p>
申请公布号 KR20080034785(A) 申请公布日期 2008.04.22
申请号 KR20070103484 申请日期 2007.10.15
申请人 BROADCOM CORPORATION 发明人 WAEL WILLIAM DIAB;SHIMON ELKAYAM
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
主权项
地址