| 摘要 |
A multi-layer electronic device can be formed to include an insulative substrate ( 212 ), a first vapor deposited conductor layer ( 312 ) on the insulative substrate ( 212 ), a first vapor deposited insulator layer ( 314 ) on the first conductor layer ( 312 ), the first insulator layer ( 314 ) having at least one via hole ( 316 ) therein, and a vapor deposited conductive filler ( 320 ) in the via hole ( 316 ) of the first insulator layer ( 314 ). Desirably, the conductive filler ( 320 ) is deposited in the via hole ( 316 ) of the first insulator layer ( 314 ) such that the surface of the conductive filler ( 320 ) opposite the first conductor layer ( 312 ) is substantially planar with the surface of the first insulator layer ( 314 ) opposite the first conductor layer ( 312 ).
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