摘要 |
An apparatus for emitting a heat of electronic devices is provided to maintain an optimum operational state of the electronic devices by cooing a heat with a cooling fan and a heat pipe. An apparatus for emitting a heat of electronic devices includes a heat sink(104), at least one heat pipe(105), an adhesive unit, and at least one cooling fan(106). The heat sink is fixed on the other side of the electronic devices, and is fixed on an inner plane of a casing to divide a space region of a ventilation unit which is formed on the electronic devices and the casing. A plurality of heat sink fins are formed to have a predetermined gap on the other plane of the heat sink. An end of the heat pipe is adhered to a heat radiation plate of the electronic devices. The other end of the heat pipe is coupled to the heat sink. The heat sink transfers a heat generated from the heat emission plate to the heat sink. The adhesive unit attaches or detaches the heat pipe to the heat emission plate. The cooling fan is installed on the other side of the casing which is divided by the heat sink. The cooling fan flows an external air to an insertion hole formed on the other side of the casing, and ventilates the external air to a heat emission piece.
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