发明名称 METAL-COATED POLYIMIDE FILM
摘要 <p>Disclosed is a metal-coated polyimide film which is excellent in long-term adhesion reliability and various dimensional stabilities and thus suitable for wiring boards for high-density mounting such as COF. Specifically disclosed is a metal-coated polyimide film wherein a metal layer is directly formed on one or both surfaces of a non-thermoplastic polyimide film without using an adhesive. This metal-coated polyimide film is characterized in that the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a block component of a thermoplastic polyimide.</p>
申请公布号 KR20080034876(A) 申请公布日期 2008.04.22
申请号 KR20087000140 申请日期 2006.08.03
申请人 KANEKA CORPORATION 发明人 KANESHIRO HISAYASU;KIKUCHI TAKASHI;FUJIMOTO SHOGO
分类号 B32B15/088;B32B27/34;C08G73/10;H05K1/03 主分类号 B32B15/088
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