发明名称 |
METAL-COATED POLYIMIDE FILM |
摘要 |
<p>Disclosed is a metal-coated polyimide film which is excellent in long-term adhesion reliability and various dimensional stabilities and thus suitable for wiring boards for high-density mounting such as COF. Specifically disclosed is a metal-coated polyimide film wherein a metal layer is directly formed on one or both surfaces of a non-thermoplastic polyimide film without using an adhesive. This metal-coated polyimide film is characterized in that the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a block component of a thermoplastic polyimide.</p> |
申请公布号 |
KR20080034876(A) |
申请公布日期 |
2008.04.22 |
申请号 |
KR20087000140 |
申请日期 |
2006.08.03 |
申请人 |
KANEKA CORPORATION |
发明人 |
KANESHIRO HISAYASU;KIKUCHI TAKASHI;FUJIMOTO SHOGO |
分类号 |
B32B15/088;B32B27/34;C08G73/10;H05K1/03 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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