TRAY FOR CUTING SEMICONDUCTOR DEVICE

摘要

A tray for cutting semiconductor devices is provided to prevent a pad from being out of line by sucking a groove formed on a pad through a vacuum hole to fix the firmly pad. A base(200) is provided with a through-hole(220) at a center portion and at least one vacuum hole(230) formed around the through-hole. The base has plural cut region each positioned corresponding to each semiconductor device. A pad has a protrusion formed at a center portion of a bottom surface, and the protrusion is provided with a hole(111) at a center portion thereof. The protrusion of the pad is inserted in the through-hole of the base. At least one damping boss is formed on the upper surface of the pad.