| 摘要 |
A light receiving module M comprises a photodiode 1 , an IC chip 2 , a light permeable and electrically insulating sealing resin member 4 for sealing the photodiode 1 and the IC chip 2 , a lens 43 provided at a surface of the sealing resin member 4 facing the photodiode 1 , and a light impermeable and conductive coating 5 for covering the sealing resin member 4 with the lens 43 being exposed. The coating 5 is connected to the ground and is made of a conductive resin, while being formed with a vertical wall 51 surrounding the lens 43. |
