| 摘要 |
<p>Photoresist spinner equipment and a control method thereof are provided to directly measure thickness of a photoresist coated on a wafer using a thickness gauge, thereby increasing productivity in semiconductor fabrication. Photoresist spinner equipment(200) comprises a wafer cassette loader, an index arm, a wafer transfer(250), a spin coater, a bake unit, a cooling unit(270), and a thickness gauge(280). The wafer cassette loader is configured to load a wafer cassette. The index arm takes a wafer out of the wafer cassette loaded in the cassette loader. The wafer transfer transfers the wafer taken out by the index arm. The spin coater rotates the wafer from an alignment stage and index arm at high speed to coat a photoresist onto the wafer. The bake unit heats the wafer to harden the photoresist coated on the wafer. The cooling unit cools the wafer heated in the bake unit. The thickness gauge is installed within the cooling unit to measure the thickness of the photoresist cooled in the cooling unit, comprising a contact sensor having a step sensor which measures the thickness of the photoresist by inserting a probe into the photoresist, and a non-contact sensor having a photo sensor which measures the thickness of the photoresist by projecting predetermined light to the photoresist.</p> |
