| 摘要 |
A method for manufacturing an image sensor is provided to prevent a micro lens and a color filter from being damaged by using a protective layer when a back grinding is performed on a rear surface of a substrate. Plural wirings and a dielectric layer are formed on a substrate with a photodiode. A color filter is formed on the dielectric layer, and then a micro lens is formed on the color filter(S101). A protection layer is applied on the micro lens and the color filter to have a predetermined thickness(S103). A back grinding process is performed on a rear surface of the substrate(S105), and then a sawing process is performed on the substrate is to package an image sensor(S107). The protection layer is made of polymeric elastomer.
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