发明名称 LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, MANUFACTURING METHOD OF WIRING SUBSTRATE, MANUFACTURING METHOD OF DISPLAY APPARATUS AND WIRING SUBSTRATE
摘要 A laser processing apparatus, a laser processing method, a manufacturing method of wiring substrate, a manufacturing method of display apparatus and a wiring substrate are provided to simplify the laser process by using laser beam having a wavelength which is selected based on a reflexibility of a multi-layer film. A laser processing apparatus(1) comprises a support table(2) for supporting a processing object(3), a local exhaust device(4) and a laser source unit for generating laser beam. The local exhaust device allows laser beam to direct toward a local exhaust unit, in which internal pressure is locally adjusted with respect to the support table. The local exhaust device is lifted relative to the support table by jetting lift gas toward the support table. The processing object includes a multi-layer film having at least two layers having different materials. A reflexibility of the processing object is input into an input unit, which is connected to the laser source unit.
申请公布号 KR20080031824(A) 申请公布日期 2008.04.11
申请号 KR20070100276 申请日期 2007.10.05
申请人 SONY CORPORATION 发明人 SHIMODA KAZUHITO;KOSHIISHI RYO;TOMIOKA SATOSHI;KAWABE HIDEO
分类号 B23K26/14;B23K26/00 主分类号 B23K26/14
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