| 摘要 |
A proximity processing using controlled batch volume with an integrated proximity head is provided to reduce the operation cost in manufacturing a semiconductor device by minimizing the use of chemicals during treating a substrate. A plating assembly(120) comprises a delivery unit(200A), a receiving unit(200B) and a path. The delivery unit includes an inner chamber and an outer surface, and has an opening interfaced by a first porous insert. The receiving unit includes an inner volume and an outer surface, and has an opening interfaced by a second porous insert. The path is defined as a distance by the delivery unit and the receiving unit. The second porous insert is substantially aligned with the first porous insert to define a plating meniscus. As a substrate(150) moves along the plating meniscus, the substrate is plated with plating solution(128) of the plating meniscus. |
