PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board having an embedded electronic component and a manufacturing method thereof are provided to minimize a warpage phenomenon generated in mounting the electronic component by including an up and down symmetrical structure. A printed circuit board includes a core substrate(2), a cavity(4), an electronic component(12), and circuit patterns(8,20). The cavity is formed by perforating a part of the core substrate. The electronic component is received in the cavity. The circuit patterns are formed on one surface of the core substrate and cover a part of the electronic component. Thicknesses of the electronic component and a terminal thereof correspond to thicknesses of the core substrate and the circuit patterns respectively.