PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD OBTAINED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible circuit board capable of suppressing warpage occurrence after heat curing, and to provide the flexible circuit board obtained by using the same.

SOLUTION: The photosensitive resin composition for the flexible circuit board includes (A) a carboxyl-group containing linear polymer having a glass transition temperature of ≤55°C obtained by obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; and (C) a photopolymerization initiator. The flexible circuit board is obtained by forming a photosensitive resin composition layer on a conductor circuit pattern by using the photosensitive resin composition; exposing the layer in a prescribed pattern; and developing it to form a cover insulation layer.

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