发明名称 ELECTRONIC APPLIANCE AND COOLING COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic appliance equipped with a substrate on which an electronic circuit is loaded in a casing, the substrate being loaded with heating components on its both sides for efficiently transmitting and radiating the heat of the heating components on the both sides of the substrate even in a narrow space. <P>SOLUTION: This electronic appliance is provided with a casing; a substrate loaded with a heating component on a first face, loaded with a heating component on a second face, and fixed in the casing; a first heat transfer component brought into contact with the heating component loaded on the first face of the substrate 61, and extended along the first face; and a second heat transfer component 110 brought into contact with the heating component loaded on the second face of the substrate, extended along the second face, and fastened to the first heat transfer component with the substrate 61 interposed by fastening members 170a, 170b and 170c. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008084215(A) 申请公布日期 2008.04.10
申请号 JP20060265959 申请日期 2006.09.28
申请人 FUJITSU LTD;FUJITSU PERIPHERALS LTD 发明人 CHIKASAWA NAGAHISA;ADACHI KATSUMI
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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