| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which facilitates wiring design of a circuit board and can be improved in noise characteristic, etc. SOLUTION: The semiconductor device 100 includes the circuit board 3 formed with first and second substrate terminals 1 and 2 on the surface, a non-volatile memory chip 4 placed on the circuit board 3, and a controller chip 5 placed on the non-volatile memory chip 4. The plurality of first substrate terminals 1 formed along a first side 4a on the circuit board 3 are each connected to one of first bonding pads 4b by wire bonding, while the plurality of second substrate terminals 2 formed on the circuit board 3 are each connected to one of second bonding pads 5b by wire bonding. The rest of the first bonding pads 4a are each connected to one of the remaining second bonding pads 5a by inverse bonding. COPYRIGHT: (C)2008,JPO&INPIT
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