| 摘要 |
PROBLEM TO BE SOLVED: To reduce variations in sensor characteristics by reducing the size of low-melting-point glass to which a sensor chip is pasted. SOLUTION: A metal stem 30 is provided with a recession part 30a, and the low-melting-point glass 51 is arranged in the recession part 30a. The sensor chip 50 is housed in the recession part 30a and joined to the metal stem 30 via the low-melting-point glass 51. Since the amount of movement of the sensor chip 50 is thereby restricted by the size of the low-melting-point glass 51 even if the sensor chip 50 moves within the low-melting-point glass 51, it is possible to reduce the amount of displacement of the sensor chip 50 from a center part of a distortion part 32 more than before. It is therefore possible to reduce variations in sensor characteristics such as sensitivity variations of each sensor. COPYRIGHT: (C)2008,JPO&INPIT
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