| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet and an integrated sheet which are excellent in the filling ability of the unevenness caused by the wiring, wires and the like, and are little in the squeeze-out of a resin from a chip end part at the time of filling the unevenness, and besides satisfy the heat resistance and moisture resistance, and to provide a semiconductor device and a method for manufacturing a semiconductor device. SOLUTION: The adhesive sheet which is used for the adhesion and lamination of an adhesive sheet-attached semiconductor chip that is a laminate of the adhesive sheet and a semiconductor chip, to a substrate having the unevenness or hollow-wire wiring or to a semiconductor chip at a rate of 0.01-200 mm/s and with a load of 0.001-1 MPa and which is a thickness of 10-100μm, is characterized in that at a measurement of the shear modulus at 70°C before the cure, a ratio G'(1%)/G'(10%) of a storage modulus G'(1%) when the strain is 1% to a storage modulus G'(10%) when the strain is 10%, is 1.2-100 and that at a measurement under the condition at 70°C before the cure at a shear rate of 0.1 (s<SP>-1</SP>)and a strain of 0.4%, a melt viscosity is 100 Pa s-250,000 Pa s. COPYRIGHT: (C)2008,JPO&INPIT |
