| 摘要 |
A method for repairing a metal finish layer on a surface of an electrical connection pad of a circuit board is provided. Firstly, a circuit board having a plurality of electrical connection pads on a surface thereof is provided, and a plurality of metal finish layers are formed on surfaces of the electrical connection pads, wherein some of the metal finish layers have at least a fault. Then, a micro deposition process is performed on the metal finish layer having the fault using micro droplets. Therefore, a production yield can be improved and a fabrication cost can be reduced as a result.
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