| 摘要 |
<p>The dust-protected computer, electronic devices and electronic cooler comprise housings implemented in the area of an air inlet opening from open-pore metallic foam, cooling bodies and/or ventilator, on which nano-coating is introduced. The metal foam is formed as a completely solvable housing wall, partially integrates into a flat housing wall, from which removable housing segment is formed and which has foam segments, is provided with an anti-static coating, and is graded, so that the pores from the outside of the foam to the inside is constantly large or small. The dust-protected computer, electronic devices and electronic cooler comprise housings implemented in the area of an air inlet opening from open-pore metallic foam, cooling bodies and/or ventilator, on which nano-coating is introduced. The metal foam is formed as a completely solvable housing wall, partially integrates into a flat housing wall, from which removable housing segment is formed and which has foam segments, is provided with an anti-static coating, and is graded, so that the pores from the outside of the foam to the inside is constantly large or small. The outside of the metal foam has a larger roughness than the inside.</p> |
