Thermosiphon zur Kühlung einer Elektronik mit Hochleistungsoberflächen zur Verdampfung und Kondensation,申请号DE2003615096T-传众专利搜索

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发明名称	Thermosiphon zur Kühlung einer Elektronik mit Hochleistungsoberflächen zur Verdampfung und Kondensation
摘要
申请公布号	DE60315096(T2)	申请公布日期	2008.04.10
申请号	DE2003615096T	申请日期	2003.06.25
申请人	DELPHI TECHNOLOGIES INC.	发明人	REYZIN, ILYA;BHATTI, MOHINDER S.;GHOSH, DEBASHIS;JOSHI, SHRIKANT MUKUND
分类号	H05K7/20;F28D15/02;H01L23/427	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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