发明名称 |
ELECTRONIC CIRCUIT AND ITS MANUFACTURING METHOD, AND MOBILE TERMINAL WITH ELECTRONIC CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To effectively suppress an electromagnetic wave noise without blocking its light weight and without raising its cost. SOLUTION: A flexible printed wiring board 1 includes a ground layer 4 exposing outside on the back side corresponding to the surface side with an electronic component 2 mounted. A conductor-made reinforced board 10 has an opening 11 and adhered to the backside of the electronic component mounted surface of the flexible printed wiring board 1. A conductor-made cushion material 30 is arranged so as to be sandwiched between the exposed ground layer 4 and conductor-made reinforced board 10 of the flexible wiring board 1 and a ground layer 21 of a main wiring board 20 to ground the exposed ground layer 4 and the conductor-made reincorced board 10 of the flexible printed wiring board 1 to the ground layer 21 of the main wiring board 20. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008085021(A) |
申请公布日期 |
2008.04.10 |
申请号 |
JP20060262088 |
申请日期 |
2006.09.27 |
申请人 |
SONY ERICSSON MOBILECOMMUNICATIONS JAPAN INC |
发明人 |
WATANABE KENJI |
分类号 |
H05K1/14;H05K1/02;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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