| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounted substrate on which functional components are easily mounted and assembled and which is advantageously in cost reduction and has an insulating coating free of a decrease in film thickness at an edge part. SOLUTION: An insulating film 11 is formed of an electrodeposited film, and has ground electrodes 111, 115, etc., for exposing a surface of a conductive base body 10 on at least one surface of the conductive base body 10 and covers the entire surface of the conductive base body 10 except the ground electrodes 111, 115, etc. The conductive base body 10 is in a flat plate shape and has its edge part rounded. COPYRIGHT: (C)2008,JPO&INPIT
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