| 摘要 |
PROBLEM TO BE SOLVED: To reduce damage to an interlayer insulating film when forming a structure with a first wiring and a second wiring embedded in the interlayer insulating film, where the second wiring is laminated on the first wiring and electrically connected to the first wiring. SOLUTION: After forming a first pattern corresponding to the first wiring on a first sacrificial film, a metal is embedded in the first pattern. Next, after forming a second sacrificial film on the first sacrificial film, a second pattern corresponding to a second wiring is formed and a metal is embedded in the second pattern. After that, the first sacrificial film and the second sacrificial film are removed to form the first wiring and the second wiring. Furthermore, the films are covered with barrier films and then the interlayer insulating film is formed so as to cover the barrier films. COPYRIGHT: (C)2008,JPO&INPIT |
