发明名称 SPUTTERING APPARATUS AND SPUTTERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus which can uniformize erosion depth. SOLUTION: This sputtering apparatus has a magnetic circuit 12 which reciprocates between end-points A and B in the vicinities of both ends in a longitudinal direction of a target 10, along the longitudinal direction. When the magnetic circuit 12 moves from one end-point to the other end-point, the magnetic circuit 12 gradually increases the speed from a constant speed V<SB>2</SB>as it approaches the end-point; after the speed has reached a high speed V<SB>3</SB>, the magnetic circuit 12 rapidly decreases the speed; when reversing the direction of movement, the magnetic circuit 12 rapidly increases the speed up to a high speed V<SB>1</SB>, and then gradually decreases the speed to make the magnetic circuit 12 move at the constant speed V<SB>2</SB>. The magnetic circuit 12 moves at a higher speed in the vicinities of the end-points (A) and (B) than in the central area, and the target 10 is eroded into uniform depth in the longitudinal direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008081805(A) 申请公布日期 2008.04.10
申请号 JP20060264231 申请日期 2006.09.28
申请人 ULVAC JAPAN LTD 发明人 KUBO MASASHI;ODAGI HIDEYUKI;KATAGIRI HIROAKI
分类号 C23C14/35 主分类号 C23C14/35
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