发明名称 HIGH POWER INSULATED GATE BIPOLAR TRANSISTORS
摘要 An insulated gate bipolar transistor (IGBT) includes a substrate (12) having a first conductivity type, a drift layer (16) having a second conductivity type opposite the first conductivity type, and a well region (18) in the drift layer and having the first conductivity type. An epitaxial channel adjustment layer (40) is on the drift layer and has the second conductivity type. An emitter region (22) extends from a surface of the epitaxial channel adjustment layer through the epitaxial channel adjustment layer and into the well region. The emitter region has the second conductivity type and at least partially defines a channel region in the well region adjacent to the emitter region. A gate oxide layer (26) is on the channel region, and a gate (28) is on the gate oxide layer. Related methods are also disclosed.
申请公布号 WO2008020911(A3) 申请公布日期 2008.04.10
申请号 WO2007US14139 申请日期 2007.06.18
申请人 CREE, INC.;ZHANG, QINGCHUN;RYU, SEI-HYUNG;JONAS, CHARLOTTE;AGARWAL, ANANT K. 发明人 ZHANG, QINGCHUN;RYU, SEI-HYUNG;JONAS, CHARLOTTE;AGARWAL, ANANT K.
分类号 H01L29/739;H01L21/04 主分类号 H01L29/739
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