WIDE BAND AND RADIO FREQUENCY WAVEGUIDE AND HYBRID INTEGRATION IN A SILICON PACKAGE
摘要
A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.
申请公布号
WO2008042478(A2)
申请公布日期
2008.04.10
申请号
WO2007US70870
申请日期
2007.06.11
申请人
MASSACHUSETTS INSTITUTE OF TECHNOLOGY;BOZLER, CARL, O.;MULDAVIN, JEREMY;WYATT, PETER, W.;KEAST, CRAIG, L.;RABE, STEVEN
发明人
BOZLER, CARL, O.;MULDAVIN, JEREMY;WYATT, PETER, W.;KEAST, CRAIG, L.;RABE, STEVEN