| 发明名称 |
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM |
| 摘要 |
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer. |
| 申请公布号 |
WO2008020984(A3) |
申请公布日期 |
2008.04.10 |
| 申请号 |
WO2007US16987 |
申请日期 |
2007.07.27 |
| 申请人 |
WORLD PROPERTIES, INC.;PAUL, SANKAR, K. |
发明人 |
PAUL, SANKAR, K. |
| 分类号 |
B05D7/16;C08L15/00;C08L71/12;C09J107/00;C09J171/12;H05K3/38 |
主分类号 |
B05D7/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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