POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD

摘要

A polyamideimide resin produced by a process comprising the step of reacting a diimide dicarboxylic acid comprising 40 mol% or more of a compound represented by the general formula (1) and 20 mol% or more of a compound represented by the general formula (2) with an aromatic diisocyanate. [chemical formula 1] (1) (2)