CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要
<p>A ceramic package and a method of manufacturing the same are provided. By using a conductive ceramic substrate as a substrate on which a light emitting diode chip or a semi-conductor chip is mounted, a heat-radiating area is increased and heat generated from the light emitting diode chip or the semiconductor chip can be easily radiated. Further, an insulating layer is formed between the conductive ceramic substrate and a surface-mounting external electrode, and thereby a short circuit between the conductive ceramic substrate and the semiconductor chip can be prevented.</p>
