| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent damage of a circuit element while miniaturizing an ultrasonic probe and realizing high-density packaging of the circuit element. <P>SOLUTION: This ultrasonic probe is provided with an ultrasonic transducer array having a plurality of ultrasonic transducers transmitting ultrasonic waves according to the applied drive signal, receiving the ultrasonic waves and generating a receiving signal, and a substrate having a plurality of wiring patterns and packaged with an integrated circuit; and is characterized in that the substrate is formed with a recess part, the ultrasonic transducer array is disposed on a backing material, and the ultrasonic transducer array and the backing material are inserted into the recess part of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
